Capillary-flow underfill compositions, packages containing same, and systems containing same

ABSTRACT

An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.

TECHNICAL FIELD

Embodiments relate generally to integrated circuit devices. Inparticular, embodiments relate to underfill compositions for integratedcircuit devices.

TECHNICAL BACKGROUND

Processors and other integrated circuit chips can generate significantheat. During miniaturization efforts, not only are circuits beingcrowded into smaller geometries, but also multiple chips are beingcrowded into smaller packages. Flip-chip configurations are affected bythe miniaturization because mounting space is also shrinkingConsequently, underfill compositions must fill smaller spaces.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to depict the manner in which the embodiments are obtained, amore particular description of embodiments briefly described above willbe rendered by reference to exemplary embodiments that are illustratedin the appended drawings. Understanding that these drawings depict onlytypical embodiments that are not necessarily drawn to scale and are nottherefore to be considered to be limiting of its scope, the embodimentswill be described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1A is a cross-section elevation of a integrated circuit packageduring underfill processing according to an embodiment;

FIG. 1B is a cross-section elevation of the integrated circuit packagedepicted in FIG. 1A after further processing;

FIG. 1C is a cross-section elevation of the integrated circuit packagedepicted in FIG. 1B after further processing;

FIG. 1D is a cross-section elevation of the integrated circuit packagedepicted in FIG. 1C after further processing;

FIG. 2 is a top plan of an underfilled integrated circuit packageaccording to an embodiment;

FIG. 3 is a flow chart that describes method flow embodiments;

FIG. 4 is a cut-away elevation that depicts a computing system accordingto an embodiment; and

FIG. 5 is a schematic of a computing system according to an embodiment.

DETAILED DESCRIPTION

The present disclosure relates to underfill compositions that haveincreased surface tension for capillary-flow underfill processes.

The following description includes terms, such as upper, lower, first,second, etc. that are used for descriptive purposes only and are not tobe construed as limiting. The embodiments of an apparatus or articledescribed herein can be manufactured, used, or shipped in a number ofpositions and orientations. The terms “die” and “chip” generally referto the physical object that is the basic workpiece that is transformedby various process operations into the desired integrated circuitdevice. A die is usually singulated from a wafer, and wafers may be madeof semiconducting, non-semiconducting, or combinations of semiconductingand non-semiconducting materials. A board is typically aresin-impregnated fiberglass structure that acts as a mounting substratefor the die. A heat spreader in this disclosure is a thin structure thatis dual-die-and-dual-heat spreader processed.

Capillary-flow underfill processing relies upon capillary pressure ofthe underfill material, to flow between a mounting substrate and anobject such as an integrated circuit die. Capillary pressure can bedescribed as

$\begin{matrix}{\Pi = \frac{2\gamma \; \cos \; \theta}{h}} & (1)\end{matrix}$

In equation (1), Π represents the capillary pressure, γ represents thesurface tension of the underfill material, h is the gap between themounting substrate and the integrated circuit die, and 0 is the wettingangle of the underfill material upon the surfaces. Flow time between themounting substrate and the integrated circuit die can be estimated bythe expression

$\begin{matrix}{T = \frac{3\mu \; L\; 2}{h\; \gamma \; \cos \; \theta}} & (2)\end{matrix}$

By finite-difference modeling the capillary flow of underfill material,we discovered that the time taken to underfill an integrated circuit diewas reduced from 19 seconds to about 7 seconds.

In an embodiment, an underfill composition is formulated with a bulkpolymer such as a bisphenol epoxy and an anhydride hardener. Otherpolymers can be used. The bulk polymer has a surface tension in a rangefrom about 20 dynes cm⁻¹ to about 30 dynes cm⁻¹. In an embodiment, thebulk polymer has a surface tension in a range from about 35 dynes cm⁻¹to about 50 dynes cm⁻¹. In an embodiment, a surface tension-increasingadditive is mixed with the bulk polymer and hardener, and the surfacetension of the underfill composition increases to greater than 30 dynescm⁻¹. In an embodiment, the surface tension-increasing additive is mixedwith the bulk polymer and hardener, and the surface tension of theunderfill composition increases to a range from about 40 dynes cm⁻¹ toabout 50 dynes cm⁻¹. This increased surface tension of the underfillcomposition can be achieved without significantly changing wetting andthermomechanical properties of the underfill composition. Consequently,the surface tension is increased over the range of 20-30 dynes cm⁻¹ by afactor from about 1.3 to about 2.5 according to various combinationalembodiments.

In an embodiment, a surface tension-increasing additive is part of thetotal underfill composition in a weight range from about 0.1% to about10%. One surface tension-increasing additive that can be used is asolvent such as glycerol. Glycerol (C₃H₈O₃, molecular formula (CH₂OH)₃), has a surface tension of about 63 dynes cm⁻¹. When added with a bulkpolymer and a hardener, the glycerol increases the overall surfacetension of the underfill composition. One surface tension-increasingadditive that can be used is a solvent such as formamide. Formamide(CH₂NO), is also known as methanamide and is an amide that can bederived from formic acid. Formamide has a surface tension of about 58dynes cm⁻¹. When added with a bulk polymer and a hardener, the formamideincreases the overall surface tension of the underfill composition.

In an embodiment, the underfill composition uses a surfacetension-increasing additive that is a flexibilizer such as a diacrylate. In an embodiment, the di acrylate is polyethylene glycol (PEG)di acrylate. In an embodiment, the di acrylate is etholxylatedbisphenol-A di acrylate. In an embodiment, the di acrylate is acombination of PEG di acrylate and etholxylated bisphenol-A di acrylate,and the PEG di acrylate is present in a greater amount than theetholxylated bisphenol-A di acrylate. In an embodiment, the di acrylateis a combination of the PEG di acrylate and the etholxylated bisphenol-Adi acrylate, and the respective di acrylates are in a substantiallyequal proportion. In an embodiment, the di acrylate is a combination ofPEG di acrylate and etholxylated bisphenol-A di acrylate, and the PEG diacrylate is present in a lesser amount than the etholxylated bisphenol-Adi acrylate.

It now should become clear that the surface tension-increasing additivecan include both a solvent that raises the surface tension, as well as aflexibilizer that raises the surface tension.

Various compositions are used as the bulk of the underfill material,including resins according to an embodiment. The underfill materialincludes resin, which may be present (including a hardener) in an amountof from about 25% to about 99.9% by weight based on the organiccomponents present, and the balance is the surface tension-increasingadditive.

In an embodiment, a cycloaliphatic epoxy resin composition is used. Inan embodiment, a bisphenol A type epoxy resin composition is used. In anembodiment, a bisphenol-F type epoxy resin composition is used. In anembodiment, a novolac epoxy resin composition is used. In an embodiment,a biphenyl type epoxy resin composition is used. In an embodiment, anaphthalene type epoxy resin composition is used. In an embodiment, adicyclopentadiene-phenol type epoxy resin composition is used. In anembodiment, a combination of any three of the compositions is used. Inan embodiment, a combination of any four of the compositions is used. Inan embodiment, a combination of any five of the compositions is used. Inan embodiment, a combination of any six of the compositions is used. Inan embodiment, a combination of all seven of the compositions is used.

In an embodiment, a cyanate ester composition or the like is used. In anembodiment, a polyimide composition or the like is used. In anembodiment, a polybenzoxazole composition or the like is used. In anembodiment, a polybenzimidazole composition or the like is used. In anembodiment, a polybenzothiazole composition or the like is used. In anembodiment, a combination of any two of the compositions is used. In anembodiment, a combination of any three of the compositions is used. Inan embodiment, a combination of any four of the compositions is used. Inan embodiment, a combination of all five of the compositions is used.

Other polymer compositions can be used as the underfill material alonebut with a hardener and a surface tension-increasing additive, or theother polymer composition can be used in combination with the enumeratedpolymer compositions.

Additive Materials

In an embodiment, other additive materials are included in addition tothe surface tension-increasing additive containing underfillcompositions. The additive materials and the underfill compositionsconstitute “underfill mixtures” according to embodiments set forthherein.

Hardeners

As set forth herein, a hardener is added to assist in assuringsufficient stiffness to the underfill composition for a givenapplication. In an embodiment, any of the diamines set forth in thisdisclosure can be combined with any of the hardeners set forth in thissection.

In an embodiment, a liquid primary aromatic diamine is used as ahardener. One example liquid primary aromatic diamine hardener isdiethyldiaminotoluene (DETDA), which is marketed as ETHACURE® 100 fromEthyl Corporation of Richmond, Va. Another example liquid primaryaromatic diamine hardener is a dithiomethyldiaminotoluene such asEthacure® 300. Another example liquid primary aromatic diamine hardeneris an alkylated methylenedianiline such as Lapox® K-450 manufactured byRoyce International of Jericho, N.Y.

In an embodiment, a liquid hindered primary aliphatic amine is used as ahardener. One example liquid hindered primary aliphatic amine is anisophorone diamine. Another example liquid hindered primary aliphaticamine is an alkylated methylenedianiline such as Ancamine® 2049manufactured by Pacific Anchor Chemical Corporation of Allentown, Pa.

In an embodiment, a liquid secondary aromatic amine is used as ahardener. One example liquid secondary aromatic amine embodiment is anN,N′-dialkylphenylene diamine such as Unilink® 0 4100 manufactured byDorfKetal of Stafford, Tex. Another example liquid secondary aromaticamine embodiment is an N,N′-dialkylmethylenedianilines: i.e. Unilink®4200.

In an embodiment, a liquid secondary aliphatic amine is used as ahardener. One example liquid secondary aliphatic amine is anN,N′-dialkylmethylene-bis-(4-aminocyclohexane) such as Clearlink® 1000manufactured by Dorf Ketal.

In an embodiment, a phenol is used as a hardener. One example phenolhardener is a bisphenol such as bisphenol A, bisphenol F, or bisphenolAP. Another example phenol hardener is a liquid novolac or cresolphenolic resin.

In an embodiment, an unsaturated compound is used as a hardener. Oneexample unsaturated compound embodiment is a vinyl-substituted aromatic.Other example unsaturated compound embodiments are allyl-substitutedaromatics and phenols such as Matrimid® B, manufactured by HuntsmanChemical of Salt Lake City, Utah, and TM124®, manufactured by Degussa ofParsippany, N.J. Other example unsaturated compound embodiments are1-prop-2-enyl substituted aromatics and phenols such as TM123®manufactured by Degussa.

In an embodiment, an epoxy resin is used as a hardener. One exampleepoxy resin hardener embodiment includes glycidyl ethers of variousbisphenols and chain extended versions thereof such as DER® 330, DER®331, and DER® 354, manufactured by Dow Chemical of Midland, Mich.Examples of epoxy resin hardeners include modified bisphenol-based epoxyresins such as DER® 353, manufactured by Dow. Other example epoxy resinhardeners include biphenyl-based epoxies. Other example epoxy resinhardeners include naphthalene-based epoxies. Other example epoxy resinhardeners include novolac and cresol multifunctional resins such as DEN®431, manufactured by Dow. Other example epoxy resin hardeners includecycloaliphatic epoxy resins. Other example epoxy resin hardeners includemonofunctional, difunctional, and multifunctional epoxy compoundsincluding those products employed as reactive diluents and modifiers.Specific examples thereof include aniline-based epoxies such as PEP®6720, manufactured by Pacific Epoxy Polymers of Richmond, Va. Otherexample epoxy resins include modified epoxy resins such ascarboxyl-terminated butadiene acrylonitrile adducts with epoxycompounds.

Any of the above hardeners may be employed alone or a mixture of severalhardeners can be reacted with the surface tension-increasing additive ina bulk polymer and react to form cured crosslinked polymers at elevatedtemperature. The nature of such reactions is often complex and caninclude Michael addition to the maleimide bond, if present, anionicpolymerization across multiple maleimide bonds, if present, Diels-Alderreactions, and ring-opening reactions. The cured underfill compositionsthus obtained have properties amenable to electronics packagingincluding high glass transition temperature and low CTE.

Catalysts

In a embodiment, a catalyst is added to the surface tension-increasingadditive in a bulk polymer in a ratio of catalyst-to-bulk polymer ofabout 0.01 parts per hundred underfill composition (any inorganicparticulates not accounted) to about 10 parts per hundred partsunderfill composition. In an embodiment, the cure property of themixture with the catalyst includes reaching a gel time in less thanabout 20 seconds at the capillary-flow underfill temperature. Aftercuring, the underfill composition has a hot hardness of greater thanabout 70 (ShoreD).

In an example embodiment, a triarylphosphine is mixed into the underfillcomposition in a range from about 0.01 to about 10 parts per hundred.The mixture is cured for about two minutes, and qualities are tested. Inan example embodiment, a trialkylphosphine is mixed into the underfillcomposition in a range from about 0.01 to about 10 parts per hundred.The mixture is cured for about two minutes, and qualities are tested.

In an example embodiment, a tetraphenylphosphine salt is mixed into theunderfill composition in a range from about 0.01 to about 10 parts perhundred. The mixture is cured for about two minutes, and qualities aretested.

In an example embodiment, a substituted imidazole is mixed into theunderfill composition in a range from about 0.01 to about 10 parts perhundred. The mixture is cured for about two minutes, and qualities aretested. In an example embodiment, an unsubstituted imidazole is mixedinto the underfill composition in a range from about 0.01 to about 10parts per hundred. The mixture is cured for about two minutes, andqualities are tested.

In an example embodiment, an aryl-terteriary amine is mixed into theunderfill composition in a range from about 0.01 to about 10 parts perhundred. The mixture is cured for about two minutes, and qualities aretested. In an example embodiment, an alkyl-terteriary amine is mixedinto the underfill composition in a range from about 0.01 to about 10parts per hundred. The mixture is cured for about two minutes, andqualities are tested.

In an example embodiment, a phenol is mixed into the underfillcomposition in a range from about 0.01 to about 10 parts per hundred.The mixture is cured for about two minutes, and qualities are tested. Inan example embodiment, a phenoxide is mixed into the underfillcomposition in a range from about 0.01 to about 10 parts per hundred.The mixture is cured for about two minutes, and qualities are tested.

Fluxing Agents

In an embodiment, fluxing agents are added to assist in assuring qualityelectrical connections between the bumps and the bond pads duringreflow. In an embodiment, a sulfonic acid-releasing fluxing agent isused. Sulfonic acids (R-SO₃H) are “isoesters” of carboxylic acids.Sulfonamides cannot only be activated thermally, but with the additionof a base such as tertiary amines, they release acidic hydrogen atoms,forming strong acids for reactions. Fluxes that can be activated atlower temperatures, such as from about 100° C. to about 300° C., aretherefore useful.

One fluxing agent type includes organic carboxylic acids and the like.Another fluxing agent type includes polymeric fluxing agents and thelike. The examples of fluxing agents are any chemicals containing ahydroxyl (—OH) group or a carboxylic (—COOH) group or both, such asglycerin, ethylene glycol, tartaric acid, adipic acid, citric acid,malic acid, meilic acid, and glutaric acid. The fluxing agent is usableduring processing at the temperature ranges set forth in this disclosurefor the catalyst and/or hardener embodiments, as well as temperaturesranging between about 100° C. to about 300° C. In an embodiment, thefluxing agent is provided in a range from about 1% to about 20% byweight of the total underfill composition when it is prepared.

Elastomers

In an embodiment, one additive material is an elastomer for impartingflexibility to the underfill composition. In an embodiment, theelastomer is provided in a range from about 0.5% about 5% by weight ofthe total underfill composition when it is prepared.

Reactive Diluents

Another additive material, according to an embodiment, is a reactivediluent. The specific reactive diluent that is employed will depend uponcompatibility with the underfill composition. Because of the bonding andsealing nature of the process embodiments, the reactive diluent canreact with and dissolve into the final underfill mixture beforevolatilizing, or it can both react and dissolve without beingvolatilized.

Reactive diluents for the above underfill compositions according toembodiments include low viscosity epoxy monomers such as Bi-phenylepoxy, Bis-Phenol A epoxy, Bis-Phenol F epoxy, or the like. Otherepoxies include phenyl glycidyl ethers, nonyl phenyl glycidyl ethers,p-butylphenyl glycidyl ethers, alkyl C₈-C₁₄ glycidyl ethers, cycloaliphatic epoxies and the like. In an embodiment, the reactive diluentis provided in a range from about 1% to about 10% by weight of the totalunderfill composition when it is prepared. The reactive diluent cantherefore cure or cross-link during curing.

Adhesion Promoters

Another additive material, according to an embodiment, is an adhesionpromoter. The specific adhesion promoter that is employed depends uponcompatibility with the given underfill composition. Adhesion promotersthat can be added to the above underfill compositions include organicand inorganic combinations. In an embodiment, a silane coupling agent orthe like is used as an adhesion promoter. In an embodiment, anorgano-ziconate composition or the like is used as an adhesion promoter.In an embodiment, an organo-titanate composition or the like is used asan adhesion promoter. In an embodiment, the adhesion promoter isprovided in a range from about 0.1% to about 5% by weight of the totalunderfill composition when it is prepared.

Flow Modifiers

Another additive material, according to an embodiment, is a flowmodifier such as a surfactant. The specific flow modifier that isemployed depends upon compatibility with the underfill composition. Thesurfactant requires properties such as compatibility with the underfillcomposition. In an embodiment, the surfactant is anionic such as longchain alkyl carboxylic acids, such as lauric acids, steric acids, andthe like. In an embodiment, the surfactant is nonionic. Examples ofnonionic surfactants are polyethylene oxides, poly propylene oxides, andthe like. In an embodiment, the surfactant is cationic such as alkylammonium salts such as tert butyl ammonium chlorides, or hydroxides. Inan embodiment, the flow modifier is provided in a range from about 0.1%to about 1% by weight of the total underfill composition when it isprepared.

Defoaming Agents

Another additive material, according to an embodiment, is a defoamingagent. The specific defoaming agent that is employed depends uponcompatibility with the principal underfill composition. In an embodimentthe defoaming agent is provided in a range from about 0.1% to about 2%by weight of the total underfill composition when it is prepared.Typical defoamers include silicones and acrylic polymers, i.e. Defoamer45, Defoamer 455 (Dow), and various silicone oils.

Toughening Agents

Another additive material, according to an embodiment, is a tougheningagent. A toughening agent causes the underfill composition to resistcrack propagation. In an embodiment, an elastomer is used as thetoughening agent. The specific elastomer that is employed to toughen thematrix depends upon compatibility with the underfill composition. Forexample, an elastomer that is used is carboxy-terminatedpolybutadiene-acrylonitrile (CTBN). CTBN is the generic name for afamily of elastomer additives for epoxies, with the primary elastomerbeing functionalized butadine-acrylonitrile copolymer. These elastomersare available as epoxy, carboxy, amino and vinyl terminalfunctionalities. In an embodiment, rubber particles are used astoughening agents. The rubber particles can also be added as liquid andcured to become a toughening agent. Other elastomers may be used thatare compatible with a given underfill composition. In an embodiment, thetoughening agent is provided in a range from about 1% to about 10% byweight of the total underfill composition when it is prepared.

Fillers

Another additive material, according to an embodiment, is an inorganicparticulate filler. Inorganic particulate fillers that optionally areadded to the underfill mixtures include oxides of various elements suchas silica, alumina, and others. Other inorganic particulate fillersinclude nitrides such as silicon nitride and the like. Other inorganicparticulate fillers include conductive materials such as graphite,diamond, and the like. When an inorganic particulate filler is added,the underfill mixture is more appropriately referred to as an “underfillcomposite”, in that it has inorganic particulate fillers as existingtechnology does, but it includes an underfill composition according tovarious embodiments. The underfill composite embodiments, unlike mostother embodiments, include a multiple-phase substance. In an embodiment,the inorganic particulate filler is provided in a range from about 1% toabout 70% by weight of the total underfill composite when it isprepared.

Radical Inhibitors

Another additive material includes at least one radical inhibitor.Radical inhibitors, such as butylatedhydroxystyrene (BHT), slow thepolymerization of monomers if present, and can be used to achieveselected properties, among which are toughness, CTE, moisture content,and others. In an embodiment, the degree of polymerization is in a rangefrom about 10% to about 100%. Approximate 100% polymerization leads to arigid polymer. In an embodiment, the degree of polymerization is in arange from about 20% to about 95%. Approximate 95% polymerization leadsto a semi-rigid polymer. In an embodiment, the degree of polymerizationis in a range from about 30% to about 90%. Approximate 90%polymerization leads to a semi-flexible polymer. In an embodiment, thedegree of polymerization is in a range from about 40% to about 85%.Approximate 85% polymerization leads to a flexible polymer. In anembodiment, the degree of polymerization is in a range from about 50% toabout 80%. Approximate 80% polymerization leads to a semi-deformablepolymer. In an embodiment, the degree of polymerization is in a rangefrom about 60% to about 75%. Approximate 75% polymerization leads to adeformable polymer.

Reference will now be made to the drawings wherein like structures willbe provided with like suffix reference designations. In order to showthe structures of various embodiments most clearly, the drawingsincluded herein are diagrammatic representations of integrated circuitstructures. Thus, the actual appearance of the fabricated structures,for example in a photomicrograph, may appear different while stillincorporating the essential structures of the illustrated embodiments.Moreover, the drawings show the structures necessary to understand theillustrated embodiments. Additional structures known in the art have notbeen included to maintain the clarity of the drawings.

FIG. 1A is a cross-section elevation of a integrated circuit package 100during underfill processing according to an embodiment. An integratedcircuit (IC) die 110 is flip-chip disposed above a mounting substrate112 and is electrically coupled to the mounting substrate 112 through aseries of electrical bumps, one of which is indicated with the referencenumeral 114.

An underfill composition 116 is depicted as beginning to flow betweenthe IC die 110 and the mounting substrate 112 by capillary action. Theunderfill composition 116 has a surface tension in a range greater than30 dyne cm⁻¹. In an embodiment, the underfill composition has a surfacetension during capillary-flow underfilling in a range from about 40 dynecm⁻¹ to about 50 dyne cm⁻¹. In an embodiment, the underfill compositionincludes additives that make it an underfill mixture according to any ofthe embodiments and their equivalents set forth in this disclosure. Inan embodiment, the underfill composition includes filler additives thatmake it an underfill composite according to any of the embodiments andtheir equivalents set forth in this disclosure.

FIG. 1B is a cross-section elevation of the integrated circuit packagedepicted in FIG. 1A after further processing. Hereinafter, when an“underfill composition” is referred to, it can mean any underfillcomposition as understood in this disclosure, underfill mixture, orunderfill composite.

The IC package 101 depicts further capillary flow of the underfillcomposition 116, such that it is drawing from right to left in the FIG.,from a first keep-out zone (KOZ) 118 toward a second KOZ 120. The KOZsare regions that must remain clear of underfill materials for furtherpackaging needs. The IC package also depicts a mounting substrate bump128 that electrically couples the IC die 110 through the mountingsubstrate 112.

FIG. 1C is a cross-section elevation of the integrated circuit packagedepicted in FIG. 1B after further processing. The IC package 102 depictsstill dynamic, but substantially completed capillary flow of theunderfill composition 116. Final forming of the underfill composition116, however, is such that it has not yet settled into a completedshape. The underfill composition 116 has a flow tongue 122 and a flowterminus 124, which is slightly smaller in lateral dimension (see FIG.2) than the lateral dimension of the flow tongue.

FIG. 1D is a cross-section elevation of the integrated circuit packagedepicted in FIG. 1C after further processing. The IC package 103 depictsa substantially hardened and cured underfill composition 117, such thatit has settled into a completed shape. The underfill composition 117 hasa final flow tongue 123 and a final flow terminus 125, which is slightlysmaller in lateral dimension (see FIG. 2) than the lateral dimension ofthe flow tongue.

FIG. 1D also depicts further processing of the IC package 103 such thatthe mounting substrate 112 has been located on a board 126. The IC die110 therefore makes electrical communication to the board 126 throughthe IC electrical bumps 114 and through at least one board electricalbump, one of which is depicted with reference numeral 128.

FIG. 2 is a top plan of an underfilled integrated circuit package 200according to an embodiment. The plan view can be taken in an embodimentas the plan view of the IC package 103 depicted in FIG. 1D.

The IC die 110 is depicted disposed above the mounting substrate 112 andthe board 126. The underfill composition is illustrated including thecured underfill composition 117, such that it has settled into acompleted shape. The underfill composition 117 has the final flow tongue123 and the final flow terminus 125. The final flow tongue 123 has atongue dimension 130, the IC die 110 has a die dimension 132, and thefinal flow terminus 125 has a terminus dimension 134. The terminusdimension 134 is usually less than the tongue dimension 130. In anembodiment, the ratio of the tongue dimension 130 to the die dimension132 is less than or equal to about 0.2. In an embodiment, the IC die 110has a die dimension 132 of about 10 mm, and the tongue dimension 130 isabout 2 mm.

FIG. 3 is a flow chart 300 that describes method flow embodiments.

At 310, the method includes adding a surface tension-increasing additiveto an underfill polymer composition to increase the surface tension to arange between about 40 dyne cm⁻¹ to about 50 dyne cm⁻¹. In anembodiment, the method commences and terminates at 310.

At 320, the method includes adding other additives to the surfacetension-increased underfill composition. The method at 320 can includeone or both of forming an underfill mixture and an underfill composite.In an embodiment, the method commences at 310 and terminates at 320.

At 330, the method includes allowing the underfill composition (ormixture or composite) to underfill between an IC die and a mountingsubstrate by capillary flow. In a non-limiting example, a bisphenolepoxy polymer is present at 94%, an anhydride hardener is present at 1%,and a surface tension-increasing additive is present at 5%. In anon-limiting example, the underfill composition achieves a completeunderfill process on a 10 mm-by-10 mm IC die and a 14 mm-by-14 mmmounting substrate, in a total time period of about 7 seconds. Thespacing between the IC die and the mounting substrate is about 106 μm.In a non-limiting example, the underfill composition achieves a completeunderfill process on a 10 mm-by-10 mm IC die and a 14 mm-by-14 mmmounting substrate, in a total time period of about 10 seconds. Thespacing between the IC die and the mounting substrate is about 106 μm.In an embodiment, the method commences at 310 and terminates at 330.

At 340, the method includes curing the underfill composition. Curing iscarried out at a temperature that achieves a rigid underfill compositionthat aids in protecting the active surface of the IC die, and thatoffers thermal stability to the IC die package. In an embodiment, themethod commences at 310 and terminates at 340. Curing can include athermal and chemical process that will leave the polymer(s),hardener(s), and at least one surface tension-increasing additive in achanged state that can be ascertained by observing the solution,mixture, and reaction products of the underfill composition.

At 350, the method includes mounting the underfilled IC package on aboard.

At 360, the method includes installing the underfilled IC package into acomputing system.

FIG. 4 is a cut-away elevation that depicts a computing system 400according to an embodiment. One or more of the foregoing embodiments ofthe surface tension-increasing additive containing underfillcompositions manufactured according to a process embodiment may beutilized in a computing system, such as computing system 400 of FIG. 4.Hereinafter any surface tension-increasing additive containing underfillcompositions manufactured according to a method embodiment alone or incombination with any other embodiment is referred to as an embodiment(s)configuration.

The computing system 400 includes at least one processor (not pictured),which is enclosed in an IC chip package 410 that contains a surfacetension-increasing additive containing underfill composition. Also, adata storage system 412, at least one input device such as a keyboard414, and at least one output device such as a monitor 416, are presentfor example. The computing system 400 includes a processor thatprocesses data signals, and may include, for example, a microprocessor,available from Intel Corporation. In addition to the keyboard 414, thecomputing system 400 can include another user input device such as amouse 418, for example. The computing system 400 can include astructure, after processing as depicted in FIGS. 1C, 1D, and 2 of agiven surface tension-increasing additive containing underfillcomposition manufactured according to a method embodiment.

For purposes of this disclosure, a computing system 400 embodyingcomponents in accordance with the claimed subject matter may include anysystem that utilizes a microelectronic device system, which may include,for example, at least one of the surface tension-increasing additivecontaining underfill compositions manufactured according to a methodembodiment that is coupled to data storage such as dynamic random accessmemory (DRAM), polymer memory, flash memory, and phase-change memory. Inthis embodiment, the embodiment(s) is coupled to any combination ofthese functionalities by being coupled to a processor. In an embodiment,however, an embodiment(s) configuration set forth in this disclosure iscoupled to any of these functionalities. For an example embodiment, datastorage includes an embedded DRAM cache on a die. Additionally in anembodiment, the embodiment(s) configuration that is coupled to theprocessor (not pictured) is part of the system with an embodiment(s)configuration that is coupled to the data storage of the DRAM cache.Additionally in an embodiment, an embodiment(s) configuration is coupledto the data storage system 412.

In an embodiment, the computing system 400 can also include a die thatcontains a digital signal processor (DSP), a micro controller, anapplication specific integrated circuit (ASIC), or a microprocessor. Inthis embodiment, the embodiment(s) configuration is coupled to anycombination of these functionalities by being coupled to a processor.For an example embodiment, a DSP is part of a chipset that may include astand-alone processor and the DSP as separate parts of the chipset on aboard 420. In this embodiment, an embodiment(s) configuration is coupledto the DSP, and a separate embodiment(s) configuration may be presentthat is coupled to the processor in the IC chip package 410.Additionally in an embodiment, an embodiment(s) configuration is coupledto a DSP that is mounted on the same board 420 as the IC chip package410. It can now be appreciated that the embodiment(s) configuration canbe combined as set forth with respect to the computing system 400, incombination with an embodiment(s) configuration as set forth by thevarious embodiments of the surface tension-increasing additivecontaining underfill compositions manufactured according to a methodembodiment within this disclosure and their equivalents.

It can now be appreciated that embodiments set forth in this disclosurecan be applied to devices and apparatuses other than a traditionalcomputer. For example, a die can be packaged with an embodiment(s)configuration, and placed in a portable device such as a wirelesscommunicator or a hand-held device such as a personal data assistant andthe like. Another example is a die that can be packaged with anembodiment(s) configuration and placed in a vehicle such as anautomobile, a locomotive, a watercraft, an aircraft, or a spacecraft.

FIG. 5 is a schematic of an electronic system 500 according to anembodiment. The electronic system 500 as depicted can embody thecomputing system 400 depicted in FIG. 4, but the electronic system isdepicted more schematically. The electronic system 500 incorporates atleast one electronic assembly 510, such as an IC die as illustrated inFIGS. 1C, 1D, and 2. In an embodiment, the electronic system 500 is acomputer system that includes a system bus 520 to electrically couplethe various components of the electronic system 500. The system bus 520is a single bus or any combination of busses according to variousembodiments. The electronic system 500 includes a voltage source 530that provides power to the IC die 510. In some embodiments, the voltagesource 530 supplies current to the integrated circuit 510 through thesystem bus 520.

The IC die 510 is electrically coupled to the system bus 520 andincludes any circuit, or combination of circuits according to anembodiment. In an embodiment, the IC die 510 includes a processor 512that can be of any type. As used herein, the processor 512 means anytype of circuit such as, but not limited to, a microprocessor, amicrocontroller, a graphics processor, a digital signal processor, oranother processor. Accordingly, a surface tension-increasing additivecontaining an underfill composition can be part of the electronic systemthat seats at least one die, such as a processor or a die selected froma processor, or another die that is part of a chipset. Other types ofcircuits that can be included in the IC die 510 are a custom circuit oran ASIC, such as a communications circuit 514 for use in wirelessdevices such as cellular telephones, pagers, portable computers, two-wayradios, and similar electronic systems. In an embodiment, the IC die 510includes on-die memory 516 such as static random-access memory (SRAM).In an embodiment, the IC die 510 includes on-die memory 516 such asembedded dynamic random-access memory (eDRAM).

In an embodiment, the electronic system 500 also includes an externalmemory 540 that in turn may include one or more memory elements suitableto the particular application, such as a main memory 542 in the form ofRAM, one or more hard drives 544, and/or one or more drives that handleremovable media 546, such as diskettes, compact disks (CDs), digitalvideo disks (DVDs), flash memory keys, and other removable media knownin the art.

In an embodiment, the electronic system 500 also includes a displaydevice 550, and an audio output 560. In an embodiment, the electronicsystem 500 includes an input 570, such as a keyboard, mouse, trackball,game controller, microphone, voice-recognition device, or any otherdevice that inputs information into the electronic system 500.

As shown herein, IC die 510 can be implemented in a number of differentembodiments, including an electronic package, an electronic system, acomputer system, one or more methods of fabricating an integratedcircuit, and one or more methods of fabricating an electronic assemblythat includes the surface tension-increasing additive containingunderfill compositions as set forth herein in the various embodimentsand their art-recognized equivalents. The elements, materials,geometries, dimensions, and sequence of operations can all be varied tosuit particular packaging requirements.

The Abstract is provided to comply with 37 C.F.R. §1.72 (b) requiring anabstract that will allow the reader to quickly ascertain the nature andgist of the technical disclosure. It is submitted with the understandingthat it will not be used to interpret or limit the scope or meaning ofthe claims.

In the foregoing Detailed Description, various features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the claimed embodiments of the inventionrequire more features than are expressly recited in each claim. Rather,as the following claims reflect, inventive subject matter lies in lessthan all features of a single disclosed embodiment. Thus the followingclaims are hereby incorporated into the Detailed Description, with eachclaim standing on its own as a separate preferred embodiment.

It will be readily understood to those skilled in the art that variousother changes in the details, material, and arrangements of the partsand method stages which have been described and illustrated in order toexplain the nature of this invention may be made without departing fromthe principles and scope of the invention as expressed in the subjoinedclaims.

1-17. (canceled)
 18. A process comprising: mixing a bulk polymerunderfill material and a hardener with a surface tension-increasingadditive to form an underfill composition, wherein the bulk polymerunderfill and hardener experience an increase in surface tension by afactor from about 1.3 to about 2.5 when combined with the surfacetension-increasing additive.
 19. The process of claim 18, furtherincluding flowing the underfill composition between an integratedcircuit die and a mounting substrate.
 20. The process of claim 18,further including flowing the underfill composition, by capillaryaction, between an integrated circuit die and a mounting substrate. 21.The process of claim 18, wherein the bulk polymer includes a bisphenolepoxy, the hardener includes an anhydride hardener, and the surfacetension-increasing additive is selected from a di acrylate, glycerin,formamide, and combinations thereof, the process further includingflowing the underfill composition between an integrated circuit die anda mounting substrate.
 22. The process of claim 18, wherein the bulkpolymer includes a bisphenol epoxy, the hardener includes an anhydridehardener, and the surface tension-increasing additive is selected from apolyethylene glycol di acrylate, ethoxylated bisphenol-A di acrylate,glycerin, formamide, and combinations thereof, the process furtherincluding flowing the underfill composition between an integratedcircuit die and a mounting substrate.
 23. The process of claim 18,wherein mixing includes combining the surface tension-increasingadditive to form at least one of an underfill composition, an underfillmixture, and an underfill composite, and wherein the surfacetension-increasing additive is present in a range from about 0.1 percentto about 10 percent. 24-26. (canceled)
 27. A process comprising: mixinga bulk polymer underfill material and a hardener with a surfacetension-increasing additive to form an underfill composition, whereinthe bulk polymer underfill and hardener experience an increase insurface tension by a factor from about 1.3 to about 2.5 when combinedwith the surface tension-increasing additive, wherein mixing includescombining the surface tension-increasing additive to form at least oneof an underfill composition, an underfill mixture, and an underfillcomposite, and wherein the surface tension-increasing additive ispresent in a range from about 0.1 percent to about 10 percent; andflowing the underfill composition between an integrated circuit die anda mounting substrate.
 28. The process of claim 27, wherein the bulkpolymer includes a bisphenol epoxy, the hardener includes an anhydridehardener, and the surface tension-increasing additive is selected from adi acrylate, glycerin, formamide, and combinations thereof, and whereinflowing the underfill composition is by capillary action.
 29. Theprocess of claim 27, wherein the bulk polymer includes a bisphenolepoxy, the hardener includes an anhydride hardener, and the surfacetension-increasing additive is selected from a polyethylene glycol diacrylate, ethoxylated bisphenol-A di acrylate, glycerin, formamide, andcombinations thereof, and wherein flowing the underfill composition isby capillary action.
 30. The process of claim 27, wherein flowing theunderfill composition is by capillary action.